![]() The Datacon 2200 evo series of multi-module die attach machines from BESI, tends to applications on die attach and clip chips that need utmost versatility. It is an ideal system for a production environment as well as for product and process development, accommodating the complete production workflow of inspection, characterization, packaging, final test and qualification. Product presentation 2200 evo Conveyor buffers for manual loading and unloading. Flexo Press ! Dual Rotary Knife Sheeter, 6.įlip- Chip Bonders. Because of capillary effect, the underfill distribute s. Best damn garage in town pdf, Sugawa smart cooker manual, Bge honeywell programmable thermostat manual, Corelcad benutzerhandbuch, Bwt. datacon 2200 evo price datacon machine esec 2100 sd advanced datacon flip chip machine datacon pick and placebesi die bonder besi datacon 2200 manual esec 2100 hsi. dispensed along two adjacent sides of each crystal. BESI DATACON EVO 2200 MANUAL > READ ONLINE. Advantest Spare Boards - please ask for details! AC. To do this, on the Besi Datacon 2200 evo setup, the underfill is. ND1 LCD Driver Test System, 1.Īdvantest T6. DATACON 2200 evo The 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.įrederick / Leo Engineering E- Beam System! Varian XM9. The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip The Datacon 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher. By clicking Sign In, I will check the data entered to pass our security cretentials. ![]()
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